The system offers outstanding flexibility with a modular design and can be easily reconfigured for different applications. Bond process changes are easily achieved.įINEPLACER® lambda Flexible Sub-micron Die BonderThe FINEPLACER® lambda is a flexible sub-micron bonder used for precise placement, die attach and advanced packaging. Active leveling is made possible through a motorized pitch & roll system combined with autocollimation or laser leveling. The FC150 accommodates a wide variety of processes and materials, including extremely fragile materials such as GaAs and HgCdTe. Available as a fully automated system to level, align and bond components ranging in size from 0.2 to 100 mm, the FC150 supports a complete range of bonding applications, including Reflow, Thermo-compression, Thermosonic, Adhesives and Fusion bonding. Designed to maximize accuracy and versatility, the FC150 answers almost every need in high-end bonding applications. The high degree of flexibility offered on the FC150 makes it the machine of choice for advanced research with the ability to move directly into pilot production.
DATACON 2200 EVO PLUS MANUAL
With configurations ranging from manual to full automation, the FC150 provides development and production capabilities on a single upgradeable cost-effective platform. SET FC 150 FC150: The Most Flexible High Accuracy Die Bonder with ± 0.5 µm placement accuracy and ± 1 µm post-bond accuracy, the SET FC150 Die/Flip Chip Bonder offers the latest evolutions in bonding techniques. * depending on configuration and application
FINEPLACER® femto has the best cost – performance ratio of its class in the market. It is an ideal system for a production environment as well as for product and process development, accommodating the complete production workflow of inspection, characterization, packaging, final test and qualification. This award winning system offers modular application architecture and can be flexibly equipped for a wide range of applications and processes. 12″).įINEPLACER ® femto 2 Automated Sub-micron Die Bonder The FINEPLACER® femto is a fully automated, sub-micron bonding platform for advanced packaging and optoelectronic applications.
The FJ520 is designed with the flexibility for a wide range of applications and the possible requirements of future products in mind (e.g. The substantial experience of the Hesse GmbH in transducer development and ultrasonic technology, combined with the routine in building complex machines for fully automatic production has made this development possible.
DATACON 2200 EVO PLUS PLUS
Equipped with integrated dispenser, 12” wafer handling, automatic tool changer, and application specific tooling, the 2200 evo is prepared for present and future processes and products.ĮSEC 2100 FC PLUS Esec as a renowned leader in providing die bonders for trouble free high quality mass production has integrated flip chip capability into its 2100 family of die bonders: Esec’s response to driving down the cost of flip chip technology.